Inheritance of Powdery Mildew Resistance in Sesame (Sesamum indicum L.)- a Review

Authors

  • P. Venkata Ramana Rao Andhra Pradesh Rice Research Institute & Regional Agricultural Research Station, ANGRAU, Maruteru, West Godavari district, Andhra Pradesh (534 122), India
  • G. Anuradha Institute of Biotechnology, ANGRAU, Rajendranagar, Hyderabad, Andhra Pradesh (500 030), India
  • K. Prasuna Institute of Biotechnology, ANGRAU, Rajendranagar, Hyderabad, Andhra Pradesh (500 030), India
  • V. Gouri Shankar Regional Agricultural Research Station, ANGRAU, Palem, Mahabubnagar district, Andhra Pradesh (509 215), India
  • E. A. Siddiq Institute of Biotechnology, ANGRAU, Rajendranagar, Hyderabad, Andhra Pradesh (500 030), India

Keywords:

Sesame, powdery mildew, inheritance

Abstract

Powdery mildew is an important disease of sesame (Sesamum indicum L.) causing upto 50% yield loss. It occurs on epidemic scale in areas of high rainfall and humidity coupled with low night temperature. The disease is generally managed by application of sulphur dusting and other chemicals. Use of host plant resistance is the pragmatic approach to manage the disease. For development of powdery mildew resistant/tolerant varieties/hybrids, identification of sources of resistance/tolerance and knowledge of its inheritance pattern are essential. However, reliable screening procedures are lacking. Even though wild sources like Sesamum malabaricum, Sesamum mulayanum, Sesamum prostratum etc. possess the tolerance, so far no tangible progress is made. Use of advanced technologies like molecular markers will be useful to map resistance/ tolerance gene(s) against the disease is the prerequisite which can help in the breeding programme.

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Published

2023-05-05

How to Cite

1.
Rao PVR, Anuradha G, Prasuna K, Gouri Shankar V, Siddiq EA. Inheritance of Powdery Mildew Resistance in Sesame (Sesamum indicum L.)- a Review. IJBSM [Internet]. 2023 May 5 [cited 2025 Sep. 21];4(Dec, 4):614-9. Available from: https://ojs.pphouse.org/index.php/IJBSM/article/view/449

Issue

Vol. 4 No. Dec, 4 (2013)

Section

Articles

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